Manufacturing Equipment for Electrical & Electronic Product

High Vacuum Vacuum Reflow Soldering and Brazing Oven for Photonics Packaging

Termway (Beijing) Precision Technology Co., Ltd.
  • After-sales Service:Engineer Go Oversea for Training
  • Condition:New
  • Certification:ISO, CE
  • Warranty:12 Months
  • Automatic Grade:Semiautomatic
  • Installation:Vertical

Base Info

  • Model NO.:HV3-3
  • Process Environment:Nitrogen, Formic Acid
  • Soldering Area:300*300mm
  • Chamber Height:>=100mm
  • Max Temperature:500 C
  • Maximum Vacuum:1X10-6bar
  • Heating Elements:Infrared Heating Lamps
  • Max. Heat up Ramp:120c,Minute
  • Max. Cool Down Ramp:60-120,Minute
  • Cooling Way:Nitrogen,Water-Cooled (Shell, Heating Plate)
  • Heating Plate:Sic Coated Graphite
  • Control Deviation:+,- 1°c
  • Voltage:220V 25-60A
  • Weight:360kg
  • Transport Package:Polywood Case and Foam
  • Specification:950*1200*1100mm
  • Trademark:TORCH
  • Origin:Beijing, China
  • HS Code:8514101000
  • Production Capacity:100 Set,Year

Description

Model

HV3

Soldering Size

300*300mm

Furnace height

100mm(other Hights is optional)

Maximum Temperature

500ºC

vacuum≤3Pa with mechanical pump,≤10-6Pa with molecular pump

Heat up ramp

120 ºC / minute

Cool down ramp

60-120 ºC / minute

Voltage

220V, 25-60A

Rated Power

18KW

Weight

360kg

Dimension

600*600*1300mm

Wight

250KG

The maximum heating rate

120ºC/min

The maximum cooling rate

Only water-cooled 60ºC/min, Air-cooled + water-cooled 120ºC/min

Cooling Way

Air-cooled / water-cooled (shell, heating plate)

Soldering result:
High Vacuum Vacuum Reflow Soldering and Brazing Oven for Photonics Packaging

Company information:
High Vacuum Vacuum Reflow Soldering and Brazing Oven for Photonics Packaging
High Vacuum Vacuum Reflow Soldering and Brazing Oven for Photonics PackagingHigh Vacuum Vacuum Reflow Soldering and Brazing Oven for Photonics Packaging