Manufacturing Equipment for Electrical & Electronic Product

Home > Product > Glue Dispensing System

LED Digital Tube Solid Crystal Machine/Automatic LED Semiconductor Chip Package Equipment/Die Bonder/Die Bonding Machine

Shenzhen TWSL Intelligent Equipment Co., Ltd.
  • After-sales Service：video or on Line Service
  • Precision：High Precision
  • Condition：New
  • Warranty：24 Months
  • Automatic Grade：Automatic
  • Installation：Desktop

Base Info

  • Model NO.：TY100
  • Driven Type：Electric
  • Transport Package：Exporter Wooden Carton
  • Specification：1520*1000*1700mm
  • Trademark：TianYu
  • Origin：China
  • HS Code：8449009000
  • Production Capacity：600sets,Month

Description

Basic Info.

Model NO. TY100 Driven Type Electric Transport Package Exporter Wooden Carton Specification 1520*1000*1700mm Trademark TianYu Origin China HS Code 8449009000 Production Capacity 600sets/Month

Product Description

LED Digital Tube Solid Crystal Machine/Automatic LED Semiconductor Chip Package Equipment/Die Bonder/Die Bonding MachineLED Digital Tube Solid Crystal Machine/Automatic LED Semiconductor Chip Package Equipment/Die Bonder/Die Bonding MachineLED Digital Tube Solid Crystal Machine/Automatic LED Semiconductor Chip Package Equipment/Die Bonder/Die Bonding MachineLED Digital Tube Solid Crystal Machine/Automatic LED Semiconductor Chip Package Equipment/Die Bonder/Die Bonding MachineLED Digital Tube Solid Crystal Machine/Automatic LED Semiconductor Chip Package Equipment/Die Bonder/Die Bonding MachineLED Digital Tube Solid Crystal Machine/Automatic LED Semiconductor Chip Package Equipment/Die Bonder/Die Bonding MachineLED Digital Tube Solid Crystal Machine/Automatic LED Semiconductor Chip Package Equipment/Die Bonder/Die Bonding MachineLED Digital Tube Solid Crystal Machine/Automatic LED Semiconductor Chip Package Equipment/Die Bonder/Die Bonding MachineLED Digital Tube Solid Crystal Machine/Automatic LED Semiconductor Chip Package Equipment/Die Bonder/Die Bonding MachineLED Digital Tube Solid Crystal Machine/Automatic LED Semiconductor Chip Package Equipment/Die Bonder/Die Bonding MachineFAQ

1.Q: Are you a die bonding machine factory or trading company?

A: We are a factory of die bonder machine and which license of import & export.

2.Q: Where is your factory located? How can I visit there?

A: Our die bonding machine factory is located in Dongguan City, Guangdong Province, China. The nearest airport is Shenzhen Airport (25 minutes by car). We can pick you up at that airport. Welcome to visit us!

3.Q: How long is the mechanical warranty period?

A: Complete after-sales service system, the whole machine is guaranteed for one year, and free replacement parts.

4.Q: How about the installation? Do you have after-sale service?

A: We will send professional technician to your company to install the machine and train your staff until they could operate the machine independently.

5.Q:How long we will get the machine?
A: Delivery time up machine machine model, standard machine normally can shipping out within 10days, special machine up to our PI confirmed delivery date. And after shipping you just need wait the ship container arrived to you.