Manufacturing Equipment for Electrical & Electronic Product

Solder Reflow Oven for PCB Assembly S10

Dongguan Intercontinental Technology Co., Ltd.
  • Color:Grey
  • Transport Package:Wooden Box
  • Specification:CE ,UL
  • Trademark:ETA
  • Origin:China

Base Info

  • Model NO.:Reflow Oven
  • HS Code:8515190000
  • Production Capacity:100 Set,Month

Description

GENERALOutside dimension5840 x 1360 x 1490mmStandard colorComputer greyWeight2400kgNumber of heating zonesUp10/bottm10Lengthof heating zones3480mmNumber of cooling zones2(built-in)Exhaust volume10M3/min*2 exhaustsStandard feature of control systemElectric supply required3phase, 380V 50/60HzElectric power required67KWPower for warm up36KWPower consumption12KWHeating patternUp & Bottom Hot airWarming timeApprox. 30minuteTemp. setting rangeRoom temp__300degreeControl systemPLC+ ComputerTemperature control methodPID close loop control +SSR drivingTemperature control precision± 1.0degreeTemperature deviation on PCB± 1.5degreeData storageProcess data and status storage (80GB)Abnormal alarmAbnormal temperature(extra-high/extra-low temp)Board dropped alarmTower light: yellow warming: Green-normal: Red-abnormalStandard features of conveyor systemMax. width of PCBMax: 500mm(Standard)Rail Number1 Lane Or 2 Lane   (option)Components clearanceTop/bottom clearance of PCB is 25mmConveyor heightLight → right(option: R→ L)PCB transmission agentAir-reflow=chain +mesh (Standard)Conveyor height900± 20mmConveyor speed range300~2000mm/min
Solder Reflow Oven for PCB Assembly S10