High Vacuum Reflow Oven for Chip Soldering with Formic Acid
Termway (Beijing) Precision Technology Co., Ltd.- After-sales Service：Engineer Go Oversea for Training
- Condition：New
- Certification：ISO, CE
- Warranty：12 Months
- Automatic Grade：Semiautomatic
- Installation：Vertical
Base Info
- Model NO.：HV3
- Process Environment：Nitrogen, Formic Acid
- Soldering Area：260*240mm
- Chamber Height：>=100mm
- Max Temperature：500 C
- Maximum Vacuum：1X10-6bar
- Heating Elements：Infrared Heating Lamps
- Max. Heat up Ramp：60-150c,Minute
- Max. Cool Down Ramp：60-120,Minute
- Cooling Way：Nitrogen,Water-Cooled (Shell, Heating Plate)
- Heating Plate：Sic Coated Graphite
- Control Deviation：+,- 1°c
- Voltage：220V 25-60A
- Weight：360kg
- Transport Package：Polywood Case and Foam
- Specification：950*1200*1100mm
- Trademark：TORCH
- Origin：Beijing, China
- HS Code：8514101000
- Production Capacity：100 Set,Year
Description
Model
HV3
Soldering Size
260*240mm
Furnace height
100mm(other Hights is optional)
Maximum Temperature
500ºC
Heat up ramp
Cool down ramp
Voltage
220V, 25-60A
Rated Power
18KW
Weight
360kg
Dimension
600*600*1300mm
Wight
250KG
The maximum heating rate
120ºC/min
The maximum cooling rate
Only water-cooled 60ºC/min, Air-cooled + water-cooled 120ºC/min
Cooling Way
Air-cooled / water-cooled (shell, heating plate)
Soldering result:
Company information:
