Manufacturing Equipment for Electrical & Electronic Product

High Vacuum Power Semiconductors Vacuum Soldering Pressure Oven Hv3

Termway (Beijing) Precision Technology Co., Ltd.
  • After-sales Service:Engineer Go Oversea for Training
  • Condition:New
  • Certification:ISO, CE
  • Warranty:12 Months
  • Automatic Grade:Semiautomatic
  • Installation:Vertical

Base Info

  • Model NO.:HV3
  • Process Environment:Nitrogen, Formic Acid
  • Soldering Area:260*240mm
  • Chamber Height:>=100mm
  • Max Temperature:500 C
  • Maximum Vacuum:1X10-6bar
  • Heating Elements:Infrared Heating Lamps
  • Max. Heat up Ramp:120c,Minute
  • Max. Cool Down Ramp:60-120,Minute
  • Cooling Way:Nitrogen,Water-Cooled (Shell, Heating Plate)
  • Heating Plate:Sic Coated Graphite
  • Control Deviation:+,- 1°c
  • Voltage:220V 25-60A
  • Weight:360kg
  • Transport Package:Polywood Case and Foam
  • Specification:950*1200*1100mm
  • Trademark:TORCH
  • Origin:Beijing, China
  • HS Code:8514101000
  • Production Capacity:100 Set,Year

Description

Model

HV3

Soldering Size

260*240mm

Furnace height

100mm(other Hights is optional)

Maximum Temperature

500ºC

vacuum≤3Pa with mechanical pump,≤10-4Pa with molecular pump

Heat up ramp

120 ºC / minute

Cool down ramp

60-120 ºC / minute

Voltage

220V, 25-60A

Rated Power

18KW

Weight

360kg

Dimension

600*600*1300mm

Wight

250KG

The maximum heating rate

120ºC/min

The maximum cooling rate

Only water-cooled 60ºC/min, Air-cooled + water-cooled 120ºC/min

Cooling Way

Air-cooled / water-cooled (shell, heating plate)

Soldering result:
High Vacuum Power Semiconductors Vacuum Soldering Pressure Oven Hv3

Company information:
High Vacuum Power Semiconductors Vacuum Soldering Pressure Oven Hv3
High Vacuum Power Semiconductors Vacuum Soldering Pressure Oven Hv3High Vacuum Power Semiconductors Vacuum Soldering Pressure Oven Hv3