
Benchtop Infrared Reflow Soldering Oven for SMD Line
Termway (Beijing) Precision Technology Co., Ltd.- After-sales Service:Online and Video Service
- Condition:New
- Warranty:12 Months
- Automatic Grade:Semiautomatic
- Installation:Desktop
- Effective Working Table Area:360mm * 230mm
Base Info
- Model NO.:T200C+
- Heating:Infrared Ray
- Application:SMD Soldering
- Heating Way:Infrared Ray + Hot Air Convection
- Temperature Range:Room -360 C
- Soldering Time:3min ± 1min
- Temperature Accuracy:2c up and Down
- Temperature Control System:PC Control System, SSR Non-Contact Output
- Transport Package:Plywood
- Specification:700(L) *460(W) *310(H)mm
- Trademark:Torch
- Origin:Beijing, China
- HS Code:8514200009
- Production Capacity:60 Sets,Month
Description
Basic Info.
Model NO. T200C+ Heating Infrared Ray Application SMD Soldering Heating Way Infrared Ray + Hot Air Convection Temperature Range Room -360 C Soldering Time 3min ± 1min Temperature Accuracy 2c up and Down Temperature Control System PC Control System, SSR Non-Contact Output Transport Package Plywood Specification 700(L) *460(W) *310(H)mm Trademark Torch Origin Beijing, China HS Code 8514200009 Production Capacity 60 Sets/MonthProduct Description
Small Single Zone SMD Reflow Oven PCB Soldering Oven T200C+
T200A is manufactured by Torch in 2001, which is the first desk lead free reflow oven.
As an epoch-making product, T200C break instrument controlling market in 2005. In last 4 years, T200C entered General Electric (U. S. ), Sony (Japan), the NVIDA (United States), Chinese Academy of Sciences of the semiconductor, aerospace electronics, BYD and other well-known enterprises and laboratories.
Torch develops and manufactures new products T200C+ according to requirement and need from domestic and foreign market. T200C+ is suitable to small batch products, it is the good choice for electronics enterprises and research institutes, at the same time it is the complementary equipment for large and medium-sized production line.
T200C+ unique features
Cost-effective Desk Reflow Oven utilizes forced air convection heating technology and PC software interface to make an accurate temperature profile quickly and easily. T200C+ is a fine temperature profile model with temp testing capable of lead-free soldering.
PC interface software control and visional operation
Real-time temperature testing function fills the blank of SMT industry overall world for adjusting the temperature at the real time.
Patented heater installation® For heating evenly
Patented forced air cycling and ventilating technology® For extremely uniform temperature profiling across the board.
Patented oven door actuating device® For no vibration after PCB welding.
Patented auto-open door technology® For higher efficiency on production and the door matched with seal device for keeping temperature.
Active Ventilation function for exhaust gas emission.
Exhaust purifying function for environment-friendly.
Temperature control segment | 40 segment, The segment can be set in computer according to the actual requirement. |
Temperature-zone numbers | Single-zone and multi-segment |
Temperature control system | PC control system ,SSR non-contact output |
Temperature accuracy | ± 2 ºC |
Warm-up time | 3min |
Temperature range | Room-temperature -360ºC |
Heating supply | Infrared ray + Hot air convection |
Effective working table area | 360mm * 230mm (more than A4) |
Welding time | 3min ± 1min |
Temperature curve | It can be set ,adjusted and tested according to the actual requirement . |
Cooling system | Transverse flow equal cooling |
Rated voltage | AC single-phase, 220V; 50Hz |
Rated power | 3.8KW |
Mean power | 1.6kw |
Weight | 39 kg |
Dimension | 700(L) *460(W) *310(H)mm |



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